Semiconductor and flat panel production-related machinery / development / production / sale such as the electrostatic removal device / electrostatic measurement machinery / pure water washing device / earthly affairs removal device / semiconductor inspection machinery and the import and export
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CLEANING SYSTEM
HNM-300 FOUP/FOSB Cleaning System
Various FOUP/FOSB was developed to maintain and to improve the high throughput of the semiconductor manufacture by washing FOUP and FOSB and HNM-300 of washing and a possible drying treatment was developed with one device.
The change and the arrangements changing of any process kit are also unnecessary in this one device.
Product Summary
- Throughput doubling (our old model and comparison)
- Conserve footprint (no other putting subunit)
- Superprecision washing by nozzle washing method
- Complete dryness by "Hot air knife method" and "High-speed spin method"
- Dust removal and countermeasure against static electricity equipped with fan filter unit and ionizer
- Work space securing for container separation and union
- Automatic purge function for bacteria generation prevention
- High operativeness with touch panel
- High safety is secured by abundant interlock equipping
Specification
| Dimension | 1300 (W) ×1406 (D) ×2000 (H) mm | |
| Weight | 800kg | |
| Power | 3φ, 200V±10V | |
| DI Water | Flow Rate：10LPM | Pressure：0.3MPa |
| CDA | Flow Rate：2500LPM | Pressure：0.75MPa |
| Exhaust | 3000LPM | |
| Drain | 10LPM | |
