CLEANING SYSTEM
As product development and manufacturing with a 300mm-wafer have become industry standard, FOUP cleaning is required for manufacturing of advance products. Regarding with Automatic FOUP cleaning system, we have renewed UPC-12100 which is one of the most reliable and world’s top class business showings. The brand new system is named UPC-12500 and it has been improved our previous machine with a concept of higher through-put, higher quality and energy saving which are indispensable to contemporary Semiconductor production. UPC-12500 was built with based on SEMI standard, UL and CE marking. It is also corresponds to Automated Material Handling System (AMHS) like OHT or RGV and Communication protocol (GEM300), so it is suitable for On-line control.
Various FOUP/FOSB was developed to maintain and to improve the high throughput of the semiconductor manufacture by washing FOUP and FOSB and HNM-300 of washing and a possible drying treatment was developed with one device.
The change and the arrangements changing of any process kit are also unnecessary in this one device.
Semiconductor wafer process is facing its rapid progress as pitch narrows, large size wafers are deployed to the line, and new materials are started being used in mass production.
For efficient investment, Mini Environmental concept is becoming popular and SMIF POD is widely used in 8-inch fabs.
Its clean management is now a critical issue.
Hugle Electronics has been a dominant player in cleaning system for wafer cassette and box.
Through that experience and accumulated injstall base, it developed the industry-only fully automated SMIF POD clean system with Automatic door open-close function.
Many units of this system have been installed in mass production fabs.
It is a manual set method of the precision cleaning of SMIFPOD for eight inches and the overall operation method developed to dry.
CP-2200 is the best washing for the pilot line for the research with which advanced knowledge and the latest technology only of the container washing device manufacturer of the semiconductor device are equipped etc. and the drying equipment.
As for CP-2200, washing and the dryness, etc. of the cassette are also possible.